By using state of the art imaging sensors and multiple illumination modes Nanda's inspection system is able to extract defects on a substrate with high fidelity and in real-time. Unique pattern recognition software is used to monitor the build-up of defect clusters over time and to perform root-cause analysis. The inspection module can be integrated directly into various types of semiconductor processing equipment to monitor each step of the manufacturing process.

By analysing defect maps and process parameters Nanda’s production monitoring system is an important building block for advanced process control (APC) and automated process tool fault detection and correction (FDC). Detailed inspection strategy modelling demonstrated net savings of 15-20m USD per anno using Nanda's technology in the fab compared to existing macro defect inspection systems.