Conventional: Scanning

• Complex
• High maintenance & poor matching
• Slow throughput at high sensitivity

Nanda: One-Shot Technology

• Illuminate & image full wafer at once
• No moving parts
• Best matching & stability
• High throughput AND high sensitivity

Spatial Signature Analysis

• Use automated spatial signature recognition (SSA) to rapidly identify
  equipment failure conditions.
• Minimize the need for manual review.
• Increase the reliability of the defect classification.